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SFP
SFP Plus
XFP
  XFP Metal Enclosure
XFP Release Mechanism
XFP Cage Assembly
QSFP
X2Release Mechanisms
 
Cages
EMI Fingers

 
XFP Release Mechanism
The XFP release mechanism is a metal stamped product with a molded top which is color-coated for different wavelengths. The three piece solution that attaches to the metal enclosure includes a bail, a slide, and two pins.
 
The XFP release mechanism includes a bail latch design for easy insertion and removal into the standardized XFP cage. It is widely accepted across the world as the Industry Standard for XFP transceiver modules. The robust and minimally intrusive design allows module manufacturers to easily incorporate the design into a standard XFP transceiver module. The XFP release mechanism conforms to XFP MSA and is also RoHS compliant.  
  XFP Product Data Sheet »»
Release Mechanisms Product Data Sheet »»
 
Features and Benefits  
 
• Distinct home position
• Bail rotates 90 degrees
   - Triggers mechanism to disengage
     module from cage
• Robust design, rugged
• MSA compliant
• RoHS compliant
• Easily implemented to custom applications
• Allows wide range of placement for optical plane
• Industry standard and proven designs
• Cost effective solutions
• Color-coated for different wavelengths
 
 
  Engineering Capabilities Manufacturing Capabilities Specific Industries
  • 3D Modeling
• Data Migration
• Product Design and Development
• Detailing and Drafting
• Technical Documentation
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• CNC Machining
• Sinker and Wire EDM
• Precision Tooling
• Thin Metal Prototypes
• Injection Molding
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• Aerospace
• Automotive
• Machine and Tooling
• Fiber Optics
• Medical
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