| XFP Cage Assembly |
| The XFP cage assembly includes the XFP cage, XFP heat sink, and XFP heat sink clip. The XFP cage assembly conforms to XFP MSA and is RoHS compliant. |
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XFP Product Data Sheet »»
Cages Product Data Sheet »» |
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| XFP Cage. The XFP cage assembly incorporates EMI shielding capabilities for the front, upper rear, intermediate rear, and lower rear of the cage along with providing guidance for the connector, retention of the transceiver, and features for heat sink attachment. The metal cage has compliant leads for assembly to the host board. |
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| XFP Heat Sink. Fourté produces XFP heat sinks for your standard and custom applications. The XFP heat sink is used in applications that require increased heat dissipation. The XFP heat sink includes a beveled edge which "rides up" the leading edge of the transceiver as the transceiver is inserted into the cage assembly. All Fourté XFP heat sinks abide to the .025mm flatness on the surface of the belly. |
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| XFP Heat Sink Clip. When fastened to the XFP cage, the XFP heat sink clip provides a minimum force of 5 Newtons at the interface of the XFP heat sink and XFP transceiver. The clip is designed to permit a XFP heat sink to be fastened to the XFP cage and to expand slightly during transceiver insertion in order to maintain a contact force between the transceiver and heat sink. |
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| Features and Benefits |
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• RoHS compliant
• MSA compliant
• Robust one-piece solution
-Rigid cage
• 3D foot design
-High retention force in printed circuit board
• Available in press-fit, solder post and PCI (1°) versions
• Spring fingers with two points of contact
• Optional rear-pin design for belly-to-belly applications
• One-piece stamped and formed cage
• Enables use with various board thicknesses and assembly processes
• Offer optimal EMI grounding
• Provides additional PCB real estate with opposite board-side usage
• Guarantees cages are RoHS compliant by eliminating solder
• Allow for flexibility of PCB signal routing of LEDs |
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